• DocumentCode
    2704226
  • Title

    Thermal and electrical characterization of the metal ball grid array (MBGA)

  • Author

    Solomon, Dawit ; Hoffman, Paul ; Brathwaite, George ; Robinson, Peter ; Madelung, Thomas

  • Author_Institution
    Olin Interconnect Technol., Manteca, CA, USA
  • fYear
    1995
  • fDate
    21-24 May 1995
  • Firstpage
    1011
  • Lastpage
    1015
  • Abstract
    The Ball Grid Array (BGA) package is becoming an attractive alternative to high lead count packaging technology due to its improved I/O density and better thermal and electrical performance. In this paper, thermal and electrical performance analysis of the Metal Ball Grid Array (MBGATM* package) is presented. Results of measurements, two and three dimensional field solutions and finite element calculations are shown
  • Keywords
    finite element analysis; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; MBGA; electrical performance; finite element calculations; metal ball grid array; packaging technology; thermal performance; three dimensional field solutions; two dimensional field solutions; Circuits; Conductors; Crosstalk; Dielectric substrates; Electronic packaging thermal management; Electronics packaging; Fabrication; Impedance; System performance; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1995. Proceedings., 45th
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    0-7803-2736-5
  • Type

    conf

  • DOI
    10.1109/ECTC.1995.517816
  • Filename
    517816
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2704226