Title :
A new packaging technique for an optical 90°-hybrid balanced receiver using planar lightwave circuits
Author :
Tsunetsugu, Hideki ; Hosoya, Masakaze ; Norimatsu, Seiji ; Takachio, Noboru ; Inoue, Yasuyuki ; Hata, Susumu
Author_Institution :
NTT Interdisciplinary Res. Labs., Tokyo, Japan
Abstract :
A new packaging technique for an optical 90°-hybrid balanced receiver using planar lightwave circuits (PLC) has been developed for optical frequency division multiplexing (OFDM). This receiver consists of a silica-based PLC for an optical coupler and two polarization beam splitters (PBS), two GRIN rod lenses to achieve perfect optical interconnection, and two photoreceivers each having a preamplifier and twin PIN-PDs. The photoreceivers use the microsolder bump technique to eliminate the parasitic elements of the interconnections between the preamplifier and the twin PIN-PDs, and the impedance-matched film carrier technique to achieve impedance-matched interconnection between the preamplifier and the ceramic package. This receiver achieved a broadband frequency response of 14 GHz, and, consequently, 10-Gbit/s homodyne detection. The experiments showed that a receiver fabricated with our new packaging technique has excellent performance
Keywords :
frequency division multiplexing; integrated optics; optical planar waveguides; optical receivers; optical waveguide components; packaging; 10 Gbit/s; 14 GHz; GRIN rod lenses; broadband frequency response; ceramic package; homodyne detection; impedance-matched film carrier; microsolder bump; optical 90°-hybrid balanced receiver; optical coupler; optical frequency division multiplexing; optical interconnection; packaging; photoreceivers; planar lightwave circuits; polarization beam splitters; preamplifier; silica-based PLC; twin PIN-PDs; Frequency division multiplexing; Impedance; Integrated circuit interconnections; OFDM; Optical films; Optical interconnections; Optical receivers; Packaging; Preamplifiers; Programmable control;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.517829