Title :
Development, validation and application of a thermal model of a plastic quad flat pack
Author :
Rosten, H.I. ; Parry, J.D. ; Addison, J.S. ; Viswanath, R. ; Davies, M. ; Fitzgerald, E.
Author_Institution :
Flomerics Ltd., Hampton Court, UK
Abstract :
A thermal model of a Plastic Quad Flat Pack (PQFP), developed using a computational fluid dynamics (CFD) program is presented. The model predictions are validated with junction-to-ambient thermal resistances measured in still air and infra-red measurements of the package and board surface temperatures. An application of a modified version of the model to a laptop computer is demonstrated. The work forms part of a long term programme to create and validate generic thermal models of a range of electronic parts
Keywords :
fluid dynamics; laptop computers; plastic packaging; thermal resistance; thermal resistance measurement; PQFP; computational fluid dynamics; infra-red measurements; laptop computer; package; plastic quad flat pack; surface temperature; thermal model; thermal resistance; Application software; Computational fluid dynamics; Electrical resistance measurement; Electronic packaging thermal management; Electronics packaging; Plastics; Portable computers; Predictive models; Temperature; Thermal resistance;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.517835
