Development, validation and application of a thermal model of a plastic quad flat pack

Author

Rosten, H.I. ; Parry, J.D. ; Addison, J.S. ; Viswanath, R. ; Davies, M. ; Fitzgerald, E.

Author_Institution

Flomerics Ltd., Hampton Court, UK

fYear

1995

fDate

21-24 May 1995

Firstpage

1140

Lastpage

1151

Abstract

A thermal model of a Plastic Quad Flat Pack (PQFP), developed using a computational fluid dynamics (CFD) program is presented. The model predictions are validated with junction-to-ambient thermal resistances measured in still air and infra-red measurements of the package and board surface temperatures. An application of a modified version of the model to a laptop computer is demonstrated. The work forms part of a long term programme to create and validate generic thermal models of a range of electronic parts

Keywords

fluid dynamics; laptop computers; plastic packaging; thermal resistance; thermal resistance measurement; PQFP; computational fluid dynamics; infra-red measurements; laptop computer; package; plastic quad flat pack; surface temperature; thermal model; thermal resistance; Application software; Computational fluid dynamics; Electrical resistance measurement; Electronic packaging thermal management; Electronics packaging; Plastics; Portable computers; Predictive models; Temperature; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1995. Proceedings., 45th

Conference_Location

Las Vegas, NV

Print_ISBN

0-7803-2736-5

Type

conf

DOI

10.1109/ECTC.1995.517835

Filename

517835