Title :
Improved approximations for structural reliability in thermal analysis
Author :
Jensen, Hector ; Cifuentes, Arturo O.
Author_Institution :
Santa Maria Univ., Valparaiso, Chile
Abstract :
Thermal analysis of electronic components-a critical step in assessing the reliability of a system-involves the determination of the temperature field as a function of certain design parameters which are normally subjected to error. This paper presents a general method to quantify the importance of these errors (or uncertainties) in the determination of the temperature field, and ultimately, in the assessment of the reliability of the system. An example of application, as well as the advantages of the present method, is discussed
Keywords :
reliability theory; thermal analysis; design parameters; electronic components; errors; structural reliability; temperature field; thermal analysis; Composite materials; Electronic components; Finite element methods; Heat transfer; Process design; Qualifications; Temperature distribution; Thermal conductivity; Thermal expansion; Uncertainty;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.517836
