Title :
Numerical simulation of natural convection cooled electronic enclosures
Author :
Maudgal, V. ; Joshi, Y.
Author_Institution :
Philips Technol., Cambridge, MD, USA
Abstract :
Natural convection in electronic enclosures is studied by performing three-dimensional numerical simulations. The effect of heat dissipation rate in the enclosure, material properties of enclosure walls and interboard spacing on heat transfer and flow field in the enclosure is illustrated by temperature contours, velocity contour and vector diagrams. Heat dissipation rate has strong impact on heat transfer and flow field in the enclosure. Nusselt numbers are computed that can be used in simple conduction type analysis of boards for such systems
Keywords :
cooling; flow; flow simulation; natural convection; packaging; Nusselt number; boards; conduction; electronic enclosure; flow field; heat dissipation; heat transfer; natural convection cooling; temperature contours; three-dimensional numerical simulation; vector diagrams; velocity contours; Computational fluid dynamics; Computational modeling; Electronic equipment; Electronic packaging thermal management; Electronics cooling; Heat transfer; Numerical simulation; Packaging machines; Performance analysis; Temperature;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.517838
