DocumentCode
2704857
Title
Asymmetric trajectory planning for vacuum robot motion
Author
Zou, Fengshan ; Qu, Daokui ; Wang, Jintao ; Xu, Fang
fYear
2011
fDate
9-13 May 2011
Firstpage
1
Lastpage
4
Abstract
In order to obtain high-precision and high-speed motion and reduce the residual vibration for vacuum robot, an asymmetric trajectory planning method with jerk bounded is presented. In this paper we discuss all possible profile shapes for the asymmetric trajectory planning. And then the algorithm and its implementation are proposed with a direct and complete method. At the end, we apply the proposed approach to high-precision vacuum cluster tool robot which is used in the vacuum chambers for handling semiconductor wafer. Experimental results are presented to verify the effectiveness and reliability of the proposed approach.
Keywords
cluster tools; industrial robots; motion control; path planning; reliability; semiconductor industry; vacuum techniques; vibration control; asymmetric trajectory planning; high-precision vacuum cluster tool robot; high-speed motion; jerk; profile shapes; reliability; residual vibration reduction; semiconductor wafer handling; vacuum chambers; vacuum robot motion; asymmetric profile; trajectory planning; vacuum robot;
fLanguage
English
Publisher
ieee
Conference_Titel
Robotics and Automation (ICRA), 2011 IEEE International Conference on
Conference_Location
Shanghai
ISSN
1050-4729
Print_ISBN
978-1-61284-386-5
Type
conf
DOI
10.1109/ICRA.2011.5980588
Filename
5980588
Link To Document