DocumentCode
2705045
Title
A 1.5 Ghz-band Saw Filter Using Flip-chip-bonding Technique
Author
Onishi, Keiji ; Seki, Shun-ichi ; Taguchi, Yutaka ; Bessho, Yoshihiro ; Eda, Kazuo ; Ishida, Toru
fYear
1993
fDate
9-11 Jun 1993
Firstpage
109
Lastpage
112
Keywords
Acoustic propagation; Acoustic waves; Bonding; Gold; Resins; SAW filters; Substrates; Surface acoustic wave devices; Surface acoustic waves; Surface treatment;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN
0-7803-1432-8
Type
conf
DOI
10.1109/IEMT.1993.639373
Filename
639373
Link To Document