DocumentCode :
2705045
Title :
A 1.5 Ghz-band Saw Filter Using Flip-chip-bonding Technique
Author :
Onishi, Keiji ; Seki, Shun-ichi ; Taguchi, Yutaka ; Bessho, Yoshihiro ; Eda, Kazuo ; Ishida, Toru
fYear :
1993
fDate :
9-11 Jun 1993
Firstpage :
109
Lastpage :
112
Keywords :
Acoustic propagation; Acoustic waves; Bonding; Gold; Resins; SAW filters; Substrates; Surface acoustic wave devices; Surface acoustic waves; Surface treatment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
Type :
conf
DOI :
10.1109/IEMT.1993.639373
Filename :
639373
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2705045
