Title :
Alignable lift-off transfer of device arrays via a single polymeric carrier membrane
Author :
Callahan, John J. ; Dohle, Rainer ; Martin, K.P. ; Drabik, Timothy J.
Author_Institution :
Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
We report epitaxial liftoff and direct bonding of GaAs/Alx Ga1-xAs heterostructure device arrays and continuous films, using a single, transparent polymer membrane to support the material during the etch of the sacrificial layer and to manipulate it into position for bonding in minutes. Au-Sn eutectic alloy bonding leads to a metallurgical bond in minutes. Absorption and current-voltage characteristics show that the material quality is not substantially degraded in the transfer process
Keywords :
III-V semiconductors; aluminium compounds; etching; gallium arsenide; integrated circuit technology; integrated optoelectronics; GaAs-AlGaAs; OEICs; absorption characteristics; alignable lift-off transfer; current-voltage characteristics; direct bonding; epitaxial liftoff; etching; eutectic alloy bonding; heterostructure device arrays; metallurgical bond; polymeric carrier membrane; sacrificial layer; transfer process; Biomembranes; Bonding; Gallium arsenide; Gold; Microassembly; Polyimides; Polymer films; Solvents; Substrates; Temperature;
Conference_Titel :
Electronic Components and Technology Conference, 1995. Proceedings., 45th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-2736-5
DOI :
10.1109/ECTC.1995.517855
