DocumentCode
2705553
Title
Application of non-parametric statistics of the parametric response for defect diagnosis
Author
Gudavalli, R. ; Daasch, W.R. ; Nigh, P. ; Heaberlin, D.
Author_Institution
Integrated Circuits Design & Test Lab., Portland State Univ., Portland, OR, USA
fYear
2009
fDate
1-6 Nov. 2009
Firstpage
1
Lastpage
10
Abstract
This paper presents a method using only the rank of the measurements to separate a part´s elevated response to parametric tests from its non-elevated response. The effectiveness of the proposed method is verified on the 130nm ASIC. Good die responses are correlated for same parametric tests at different conditions such as temperature, voltage and or other stress. Nonparametric correlation methods are used to calculate the intra-die correlation. When intra-die correlation is found to be low the elevated vectors that lower correlation are extracted and input to IDDQ-based diagnostic tools. Monte-Carlo simulations are described to obtain confidence bounds of the correlation for good die test response.
Keywords
Monte Carlo methods; application specific integrated circuits; integrated circuit testing; nonparametric statistics; ASIC; IDDQ-based diagnostic tool; Monte-Carlo simulation; defect diagnosis; die test response; intradie correlation; nonelevated response; nonparametric correlation; nonparametric statistics; parametric response; parametric test; size 130 nm; Application software; Circuit testing; Displays; Fault diagnosis; Inspection; Integrated circuit testing; Parametric statistics; Scattering; System testing; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2009. ITC 2009. International
Conference_Location
Austin, TX
Print_ISBN
978-1-4244-4868-5
Electronic_ISBN
978-1-4244-4867-8
Type
conf
DOI
10.1109/TEST.2009.5355728
Filename
5355728
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