• DocumentCode
    2705553
  • Title

    Application of non-parametric statistics of the parametric response for defect diagnosis

  • Author

    Gudavalli, R. ; Daasch, W.R. ; Nigh, P. ; Heaberlin, D.

  • Author_Institution
    Integrated Circuits Design & Test Lab., Portland State Univ., Portland, OR, USA
  • fYear
    2009
  • fDate
    1-6 Nov. 2009
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    This paper presents a method using only the rank of the measurements to separate a part´s elevated response to parametric tests from its non-elevated response. The effectiveness of the proposed method is verified on the 130nm ASIC. Good die responses are correlated for same parametric tests at different conditions such as temperature, voltage and or other stress. Nonparametric correlation methods are used to calculate the intra-die correlation. When intra-die correlation is found to be low the elevated vectors that lower correlation are extracted and input to IDDQ-based diagnostic tools. Monte-Carlo simulations are described to obtain confidence bounds of the correlation for good die test response.
  • Keywords
    Monte Carlo methods; application specific integrated circuits; integrated circuit testing; nonparametric statistics; ASIC; IDDQ-based diagnostic tool; Monte-Carlo simulation; defect diagnosis; die test response; intradie correlation; nonelevated response; nonparametric correlation; nonparametric statistics; parametric response; parametric test; size 130 nm; Application software; Circuit testing; Displays; Fault diagnosis; Inspection; Integrated circuit testing; Parametric statistics; Scattering; System testing; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2009. ITC 2009. International
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-4868-5
  • Electronic_ISBN
    978-1-4244-4867-8
  • Type

    conf

  • DOI
    10.1109/TEST.2009.5355728
  • Filename
    5355728