Analysis of critical wiring structures using CAPCAL V1.3

Author

Seidl, A. ; Seegebrecht, P. ; Schreil, M.

Author_Institution

Fraunhofer Inst. fur Festkorpertechnol., Munchen, West Germany

fYear

1990

fDate

12-13 Jun 1990

Firstpage

401

Lastpage

403

Abstract

Two basic features of modern VLSI technology necessitate the three-dimensional (3D) solution of electrical field problems: (1) the lateral feature size is of the same order of magnitude as typical layer thicknesses; and (2) increasing layout complexity gives rise to structures for which only a genuine 3D description is applicable. The package CAPCAL V1.3 constitutes an improved version of the program introduced by A. Seidl et al. (1988). A particular extension of V1.3 is the capability for resistance calculations. As examples of the application of CAPCAL, 3D analysis of nonplanar line crossings and contact hole resistance measurement are shown

Keywords

VLSI; circuit analysis computing; integrated circuit technology; software packages; 3D analysis; 3D description; CAPCAL V1.3; VLSI technology; contact hole resistance; critical wiring structures; electrical field problems; nonplanar line crossings; resistance calculations; Capacitance; Circuit simulation; Circuit testing; Contact resistance; Electrical resistance measurement; Geometry; Periodic structures; Planarization; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Multilevel Interconnection Conference, 1990. Proceedings., Seventh International IEEE

Conference_Location

Santa Clara, CA

Type

conf

DOI

10.1109/VMIC.1990.127912

Filename

127912