• DocumentCode
    2705828
  • Title

    Defect-oriented cell-aware ATPG and fault simulation for industrial cell libraries and designs

  • Author

    Hapke, F. ; Krenz-Baath, R. ; Glowatz, A. ; Schloeffel, J. ; Hashempour, H. ; Eichenberger, S. ; Hora, C. ; Adolfsson, D.

  • Author_Institution
    Mentor Graphics, Hamburg, Germany
  • fYear
    2009
  • fDate
    1-6 Nov. 2009
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    Industry is facing increasingly tougher quality requirements for more complex ICs. To meet these quality requirements we need to improve the defect coverage. This paper presents a new methodology to significantly increase the defect coverage of the test patterns generated by ATPG tools. The fault model used during the ATPG is enhanced to directly target layout-based intra-cell faults. In contrast to previous techniques, such as gate-exhaustive, N-detect, or embedded-multi-detect, which either are too complex for real-world designs or merely improve the probability of detecting intra-cell defects, the new approach targets the actual root causes of intra-cell defects. The newly proposed cell-aware-methodology has been evaluated for 90 nm and 65 nm technologies on 1671 library cells and on 10 real industrial designs with up to 50 million faults. The experimental results show an average increase of 1.2% in defect coverage and a reduction of 420 ppm in escape rate for a 50 mm2 design.
  • Keywords
    automatic test pattern generation; fault simulation; integrated circuit testing; cell-aware-methodology; defect coverage; fault simulation; industrial cell libraries; integrated circuit testing; intra-cell faults; size 65 nm; size 90 nm; Automatic test pattern generation; Circuit faults; Circuit testing; Fault detection; Graphics; Libraries; Pattern analysis; Production; System testing; Test pattern generators;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 2009. ITC 2009. International
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-4868-5
  • Electronic_ISBN
    978-1-4244-4867-8
  • Type

    conf

  • DOI
    10.1109/TEST.2009.5355741
  • Filename
    5355741