DocumentCode
2705957
Title
A simulation of positive corona pulse current in the gas mixtures (SF6, N2, c-C4F8)
Author
Okabe, S. ; Furuhata, T. ; Kuffe, E.
Author_Institution
Dept. of Electr. Eng., Tokai Univ., Kanagawa, Japan
fYear
1994
fDate
5-8 Jun 1994
Firstpage
508
Lastpage
511
Abstract
In this paper, we simulate a positive corona discharge in pure SF 6 gas, binary gas mixtures (SF6/N2 and SF6/c-C4F8), and ternary gas mixtures (SF6/N2/c-C4F8). The purpose of the simulation is to compare and discuss the dielectric characteristics of the gases (760 Torr, a point-plate gap) using the one-dimensional continuity equations presented by R. Morrow. In this simulation, the distribution of charged particles (electrons, positive ions, and negative ions) density, electric field distribution, and corona pulse current in each gas are computed. It is confirmed from the results of the simulation that the value of the pulse current peak and the development distance of corona streamer head from the anode in the ternary gas mixture (SF6/N2/c-C4F8 ) are much less than those in the binary gas mixture (SF6 /N2) under the same applied voltage and gap length. The values of the peak and the distance of the corona development in the binary gas mixture (SF6/c-C4F8) are restrained than the others
Keywords
SF6 insulation; corona; dielectric properties; electric breakdown; nitrogen; organic compounds; partial differential equations; 760 torr; N2; SF6; SF6-N2; SF6/N2; SF6/N2/c-C4F8; SF6/c-C4F8; binary gas mixtures; c-C4F8; density; dielectric characteristics; distribution of charged particles; electric field distribution; electrons; gas mixtures; negative ions; one-dimensional continuity equations; point-plate gap; positive corona discharge; positive corona pulse current; positive ions; simulation; ternary gas mixtures; Anodes; Computational modeling; Corona; Dielectrics; Electrons; Equations; Gases; Ionization; Space charge; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation, 1994., Conference Record of the 1994 IEEE International Symposium on
Conference_Location
Pittsburgh, PA
ISSN
1089-084X
Print_ISBN
0-7803-1942-7
Type
conf
DOI
10.1109/ELINSL.1994.401407
Filename
401407
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