Title :
High-pin-count Quad Flat Package With Thin-film Termination Resistors
Author :
Sasaki, Shinichi ; Kishimoto, Tohru
Keywords :
Bonding; Crosstalk; Electric resistance; Electrical resistance measurement; Laboratories; Large scale integration; Packaging; Prototypes; Resistors; Transistors;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
DOI :
10.1109/IEMT.1993.639382
