Title :
High Speed I/O Test Cable Assembly Interfaces for Next Generation Multi-Gigabit Serial Protocols
Author :
Vana, Jim ; Barr, Alexander ; Scherer, Richard ; Joshi, Abhay
Author_Institution :
Electron. Solutions Div., 3M Co., Austin, TX, USA
Abstract :
This poster describes high speed I/O test cable interfaces for next generation multi-gigabit serial protocols such as PCI-Express incorporating 3M¿ shielded controlled impedance (SCI) connector systems, spring probe board interfaces and low loss twinaxial cable assemblies with performance capabilities up to 12 Gbps.
Keywords :
automatic test equipment; peripheral interfaces; I/O test cable assembly interfaces; automatic test equipment; next generation multi-gigabit serial protocols; shielded controlled impedance; spring probe board interfaces; twinaxial cable assemblies; Assembly systems; Cable shielding; Connectors; Control systems; Impedance; Performance loss; Probes; Protocols; Springs; System testing;
Conference_Titel :
Test Conference, 2009. ITC 2009. International
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-4868-5
Electronic_ISBN :
978-1-4244-4867-8
DOI :
10.1109/TEST.2009.5355810
