DocumentCode :
2707238
Title :
Ceramic Flat Packages For High-speed And High-frequency
Author :
Nacata, K. ; Miyamoto, Takaharu ; Miyagawa, Fumio
fYear :
1993
fDate :
9-11 Jun 1993
Firstpage :
129
Lastpage :
132
Keywords :
Ceramics; Coaxial components; Coplanar transmission lines; Distributed parameter circuits; Frequency estimation; Packaging; Prototypes; Resonance; Scattering parameters; Transmission lines;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1993., Proceedings of 1993 Japan International
Print_ISBN :
0-7803-1432-8
Type :
conf
DOI :
10.1109/IEMT.1993.639383
Filename :
639383
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2707238
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