Optimized Substrate Integrated Waveguide Bends for Ultra-High Speed Digital Interconnects

This paper reports on an experimental and computational study of substrate integrated waveguides (SIW) optimized for use as ultrahigh-speed bandpass wireless digital interconnects. Specifically, a straight and 60deg-bend SIW optimized for narrow transverse dimensions, low loss, low crosstalk, and maximum bandwidth with no multimoding is reported in this paper. Because existing circuit-board technology permits dimensional reductions of SIWs by a factor of 4:1 relative to the ones discussed here, bandpass operation at center frequencies approaching 200 GHz with data rates of 200 Gb/sec appear feasible. These data rates meet or exceed those expected eventually for proposed optical interconnects without requiring the development of a suite of essentially revolutionary silicon photonic technologies