• DocumentCode
    2707881
  • Title

    Analysis and optimum design of RF spiral inductors on silicon substrate

  • Author

    Huang, Lu ; Zhang, Wan-Rong ; Xie, Hong-Yun ; Shen, Pei ; Gan, Jun-Ning ; Huang, Yi-Wen ; Hu, Ning

  • Author_Institution
    Coll. of Electron. Inf. & Control Eng., Beijing Univ. of Technol., Beijing, China
  • fYear
    2009
  • fDate
    27-29 Oct. 2009
  • Firstpage
    990
  • Lastpage
    993
  • Abstract
    On-chip spiral inductors with high quality factors are very important in many RF circuits. In this paper, spiral inductors are analyzed to study the influence of substrate and spiral structure on an inductor´s performance in the multi-GHz frequency range. Firstly, the inductors with different substrate conductivity, thickness and permittivity of the dielectric layer are compared, and a general guide is given that the substrate of a good performance inductor should be light impurity, the dielectric layer should be thick, and use a low k material. And then, this paper presents a novel spiral structure with gradually reduced metal width and space from outside to inside, which can help to alleviate the problems of the magnetic field intensity of a spiral inductor increasing gradually from outside to inside. Compared to conventional inductor, the maximum Q of inductor using gradually changed structure increases by 13.66%, thus the results have corroborated the validity of the proposed method.
  • Keywords
    inductors; substrates; RF circuits; RF spiral inductors; dielectric layer; magnetic field intensity; on-chip spiral inductor; radio frequency; silicon substrate; spiral structure; substrate conductivity; Circuits; Conductivity; Dielectric substrates; Inductors; Performance analysis; Permittivity; Q factor; Radio frequency; Silicon; Spirals; Quality factor; Silicon Substrate; Spiral Inductor; gradually changed structure;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, 2009 3rd IEEE International Symposium on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-4076-4
  • Type

    conf

  • DOI
    10.1109/MAPE.2009.5355842
  • Filename
    5355842