DocumentCode
2707935
Title
Experimental study of metal-metal contact properties using spin on glass
Author
Wolters, R.A.M. ; Heesters, W.C.J.
Author_Institution
Philips Res. Lab., Eindhoven, Netherlands
fYear
1990
fDate
12-13 Jun 1990
Firstpage
447
Lastpage
449
Abstract
Degassing data of cured spin-on glass (SOG) layers and wafer temperature measurements during the sputter etch process are given. A solution for the metal-metal contact problem using an in situ preheat step prior to a (soft) sputter etch process and subsequent metal deposition is presented. An improvement in IN-INS contact string resistance yield from approximately 40% to 99.5% could be achieved in this process
Keywords
VLSI; integrated circuit technology; metallisation; IN-INS contact string resistance yield; SOG; cured spin-on glass; degassing data; in situ preheat step; metal-metal contact properties; spin on glass; sputter etch process; subsequent metal deposition; wafer temperature measurements; Annealing; Contact resistance; Dielectrics; Electrical resistance measurement; Glass manufacturing; Heating; Laboratories; Performance evaluation; Sputter etching; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Multilevel Interconnection Conference, 1990. Proceedings., Seventh International IEEE
Conference_Location
Santa Clara, CA
Type
conf
DOI
10.1109/VMIC.1990.127926
Filename
127926
Link To Document