Title :
Advancements in inherently dissipative polymer (IDP) alloys provide new levels of clean, consistent ESD protection
Author :
Kim, K.J. ; Hardwick, N. ; Pham, H. ; Fahey, T.
Author_Institution :
BFGoodrich Static Control Polymers, Brecksville, OH, USA
Abstract :
A new class of inherently dissipative polymer (IDP) alloys has been developed through recent advances in IDP formulation utilizing additional charge carriers in the polymerization of the IDP. This new generation of IDP technology delivers static decay times of less than 0.1 s and surface resistance values of 10/sup 7/ /spl Omega/ which are two orders of magnitude better than previously available generations of IDPs. This IDP technology has enabled the development of a new class of IDP alloys with host polymers such as PETG, polypropylene and polyurethane. These IDP alloys reach previously unattainable surface and volume resistance levels of 10/sup 8/ /spl Omega/. These resistance values hold permanently and consistently through injection molding or extrusion due to a flat loading curve, differing from the steep loading curves in this resistance range seen in conductive filler systems. Additional optimization of the IDP alloys has led to improvements in cleanliness. Packaging and components therefore exhibit consistent, permanent surface resistance values between 10/sup 8/ and 10/sup 9/ /spl Omega/ without introducing contaminants into the cleanroom. The new class of IDP alloys provides new levels of clean, consistent ESD protection via a unique blend of electrical, physical, and cleanliness properties of the optimized alloy.
Keywords :
conducting polymers; electrostatic discharge; extrusion; moulding; optimisation; plastic packaging; polymer blends; polymerisation; protection; surface contamination; 0.1 s; 10 Mohm; 100 Mohm to 1 Gohm; IDP alloy optimization; IDP alloys; IDP formulation; IDP technology; PETG; alloy cleanliness properties; alloy electrical properties; alloy physical properties; charge carriers; clean ESD protection; cleanliness; cleanroom; components; conductive filler systems; consistent ESD protection; contaminants; extrusion; flat loading curve; host polymers; inherently dissipative polymer alloys; injection molding; optimized alloy; packaging; permanent surface resistance values; polymerization; polypropylene; polyurethane; resistance range; static decay times; steep loading curves; surface resistance; volume resistance; Charge carriers; Electric resistance; Electrostatic discharge; Injection molding; Packaging; Polymers; Protection; Surface cleaning; Surface contamination; Surface resistance;
Conference_Titel :
Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000
Conference_Location :
Anaheim, CA, USA
Print_ISBN :
1-58537-018-5
DOI :
10.1109/EOSESD.2000.890036