DocumentCode
2708582
Title
Effect of Laminate Properties on Passive Intermodulation Generation
Author
Zelenchuk, D.E. ; Shitvov, A.P. ; Schuchinsky, A.G.
Author_Institution
Queen´´s Univ. Belfast, Belfast
fYear
2007
fDate
2-3 April 2007
Firstpage
169
Lastpage
172
Abstract
The results of experimental study of passive intermodulation (PIM) on printed circuit board (PCB) laminates are reported. Comparison of PIM performance of different materials has shown correlation between the PIM level and the laminate physical properties. The effect of the line length on PIM level has been experimentally observed. A simple model has been devised to describe the relation between the line length, attenuation and PIM performance of the lengths of straight microstrip lines.
Keywords
intermodulation; laminates; microstrip lines; printed circuits; laminate property; microstrip line; passive intermodulation generation; printed circuit board; Antennas and propagation; Connectors; Copper; Dielectric materials; Dielectric measurements; Etching; Finishing; Laminates; Microstrip; Noise measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Conference, 2007. LAPC 2007. Loughborough
Conference_Location
Loughborough
Print_ISBN
1-4244-0776-1
Electronic_ISBN
1-4244-0776-1
Type
conf
DOI
10.1109/LAPC.2007.367458
Filename
4218493
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