• DocumentCode
    2708643
  • Title

    ESD performance of bridge-resistance pressure diaphragm sensors

  • Author

    Lei, Kuo-Lung ; Chu, Charles Y. ; Tseng, Justine Y. ; Chiang, Yuh-Min ; Young, Michael

  • Author_Institution
    Adv. Custom Sensors Inc., Irvine, CA, USA
  • fYear
    2000
  • fDate
    26-28 Sept. 2000
  • Firstpage
    413
  • Lastpage
    419
  • Abstract
    The ESD performance of bridge-resistance based pressure diaphragm sensors, including micromachined silicon sensors and high-performance thin film sensors, is evaluated based on sensor span and offset as failure criteria. Different micromachined silicon sensors from different vendors show considerable differences in ESD performance. It is found that sensing element construction and layout contributes significantly to sensor ESD robustness. An incoming qualifying procedure is also developed to further help sensor application companies to screen sensing elements from different vendors. In addition, weak spots in current design are also identified.
  • Keywords
    bridge circuits; diaphragms; electric resistance; electric sensing devices; electrostatic discharge; elemental semiconductors; failure analysis; micromachining; microsensors; pressure sensors; semiconductor device reliability; silicon; ESD performance; Si; bridge-resistance based pressure diaphragm sensors; bridge-resistance pressure diaphragm sensors; design weaknesses; failure criteria; micromachined silicon sensors; qualifying procedure; sensing element construction; sensing element layout; sensing element screening; sensor ESD robustness; sensor offset; sensor span; thin film sensors; Electrostatic discharge; Mechanical sensors; Piezoresistance; Resistors; Robustness; Semiconductor thin films; Silicon; Stress measurement; Tensile stress; Thin film sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000
  • Conference_Location
    Anaheim, CA, USA
  • Print_ISBN
    1-58537-018-5
  • Type

    conf

  • DOI
    10.1109/EOSESD.2000.890110
  • Filename
    890110