DocumentCode
2708815
Title
Implications of 3-D integrated circuits at board test position paper
Author
Parker, Kenneth P.
Author_Institution
Agilent Technol., Loveland, CO, USA
fYear
2009
fDate
1-6 Nov. 2009
Firstpage
1
Lastpage
2
Abstract
Three-dimensional integrated circuits are coming to circuit boards near you. Testing boards with such components offers new, yet familiar challenges. As before, we need to determine if the right device is present, oriented, live, properly aligned and attached to the board with no shorts, opens or attachment quality defects.
Keywords
integrated circuit testing; printed circuits; quality management; 3D integrated circuits; board test position; circuit boards; quality defects; Automatic optical inspection; Circuit testing; Integrated circuit interconnections; Integrated circuit technology; Integrated circuit testing; Packaging; Paper technology; Space technology; System testing; Three-dimensional integrated circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2009. ITC 2009. International
Conference_Location
Austin, TX
Print_ISBN
978-1-4244-4868-5
Electronic_ISBN
978-1-4244-4867-8
Type
conf
DOI
10.1109/TEST.2009.5355892
Filename
5355892
Link To Document