DocumentCode
2708998
Title
Testing of 3D chips: Is there anything new under the sun?
fYear
2009
fDate
1-6 Nov. 2009
Firstpage
1
Lastpage
1
Abstract
3D chips based on Through-Silicon Vias are hot in the design and processing community. What new test challenges do they bring forward, and how much of the learnings from MCM and SIP testing can be applied in this field?
Keywords
integrated circuit testing; three-dimensional integrated circuits; 3D chips testing; MCM testing; SIP testing; through-silicon vias; Bandwidth; Cost function; Electronics industry; Logic testing; Power dissipation; Process design; Semiconductor device packaging; Stacking; Sun; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 2009. ITC 2009. International
Conference_Location
Austin, TX
Print_ISBN
978-1-4244-4868-5
Electronic_ISBN
978-1-4244-4867-8
Type
conf
DOI
10.1109/TEST.2009.5355903
Filename
5355903
Link To Document