Mushroom-Like High-Impedance Surface (HIS) with Slanted VIAS

This paper presents a new high-impedance surface with slanted vias. The vias used in conventional mushroom like structures are made slanted at an angle from the center of each patch and connecting to the ground plane. Numerical simulation on reflection phase response indicates that there is a dual band frequency of operation compared with that from the conventional mushroom structures with vertical vias. Furthermore, the slanted via can be made offset along one axis which helps to tune the separation of the two resonances.