DocumentCode :
2709892
Title :
Simulation and analysis of scheduling rules for semiconductor manufacturing line
Author :
Shi, Li ; Zhang, Xiaohui ; Li, Li
Author_Institution :
Center for Space Sci. & Appl. Res., Chinese Acad. of Sci., Beijing
fYear :
2008
fDate :
21-24 April 2008
Firstpage :
1
Lastpage :
5
Abstract :
Semiconductor manufacturing has the characteristics of great size, reentrance, uncertainty and multi-objective optimization. A pheromone based dynamic scheduling algorithm, called PB, can optimize multiple performances, such as on-time delivery, cycle time, output, wafer in process and movement. Three models were set up according to Intel Minifab, Wein 24 machines and a real semiconductor fabrication line. With two release strategies, which are deterministic input and CONWIP input, first we discuss how the properties of the whole system change with different parameters alpha , beta , then we can conclude a rule to match alpha , beta in order to achieve a good performance. Finally, PB is compared with other four heuristic algorithms, which are FIFO, SRPT, EDD and CR. The simulation results show that the PB algorithm can effectively improve the cycle time and on-time delivery, and it can also be at least second optimal in all the other properties and optimize multi-objective performances.
Keywords :
dynamic scheduling; electronics industry; semiconductor device manufacture; CONWIP input; CR; EDD; FIFO; Intel Minifab; SRPT; Wein machines; multiobjective optimization; pheromone-based dynamic scheduling; scheduling rules; semiconductor fabrication line; semiconductor manufacturing line; uncertainty optimization; Analytical models; Dynamic scheduling; Fabrication; Heuristic algorithms; Job shop scheduling; Scheduling algorithm; Semiconductor device manufacture; Semiconductor device modeling; Uncertainty; Virtual manufacturing; dynamic scheduling; performance analysis; semiconductor fabrication line; simulation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Technology, 2008. ICIT 2008. IEEE International Conference on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4244-1705-6
Electronic_ISBN :
978-1-4244-1706-3
Type :
conf
DOI :
10.1109/ICIT.2008.4608675
Filename :
4608675
Link To Document :
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