• DocumentCode
    2710614
  • Title

    Effect of plasma polymer treatment on aging of polyethylene films

  • Author

    Lee, S. ; Omer, I. St ; Charlson, E.J. ; Charlson, E.M. ; Yasuda, H.K.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Missouri Univ., Columbia, MO, USA
  • fYear
    1994
  • fDate
    5-8 Jun 1994
  • Firstpage
    364
  • Lastpage
    367
  • Abstract
    Aging degradation of solid insulation is traditionally studied using various failure acceleration mechanisms alone or in combination. For example, multiple stress conditions, including electrical signals, elevated temperature, and/or a corrosive (saline) environment are often applied to molded insulation blocks that have been cut, scratched, or implanted with sharp metallic electrodes to provide a site for the onset of failure. The test configuration used in this study involves thin (50 μm) commercially available polyethylene sheets lacking artificially induced defects. Periodic measurements are made on films while they are under soak in a saline solution with a sinusoidal voltage applied. Capacitance and dissipation results are presented which are indicative of the degradation induced by the stress conditions on untreated polymer films and on polymer films which have been coated with extremely thin (<100 nm) plasma polymerized films of two monomers
  • Keywords
    ageing; capacitance; insulation testing; life testing; plasma applications; polyethylene insulation; polymer films; 50 micron; aging; capacitance; plasma polymer treatment; polyethylene films; saline environment; solid insulation; stress conditions; untreated polymer films; Aging; Degradation; Insulation; Plasma accelerators; Plasma temperature; Plastic films; Polyethylene; Polymer films; Solids; Stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 1994., Conference Record of the 1994 IEEE International Symposium on
  • Conference_Location
    Pittsburgh, PA
  • ISSN
    1089-084X
  • Print_ISBN
    0-7803-1942-7
  • Type

    conf

  • DOI
    10.1109/ELINSL.1994.401494
  • Filename
    401494