Comparison of new die-attachment technologies for power electronic assemblies

Recently, different die-attachment technologies for power modules such as electrically conductive gluing, silver sintering and transient liquid phase bonding have been investigated as alternatives to soldering. In this paper a comparison of these three die-attach technologies is given. For each an overview of the manufacturing process, as well as key performance parameters like thermal resistance and shear strength are presented. In addition the influence of temperature shock cycles on the modules is investigated. Overall, this work showed that all three die-attachment techniques can be alternatives to replace soldering in specific assembly types of power electronic devices.