Package-level Implementation of Multiband Electromagnetic Band-Gap Structures

The design and implementation of package-level electromagnetic band-gap structures is demonstrated. By using spiral-based electromagnetic band-gap structures (EBG), the relative periodicity for achieving band-gap at extremely low frequency is substantially minimized in comparison to traditional EBG´s. Using both full wave electromagnetic simulation and experimental characterization it is demonstrated that this type of structure can exhibit multiple band-gaps, which are individually tunable through variation of the inductance per unit area and its periodicity. Sample structures with dimensions compatible to today´s packaging technology are fabricated and show stop-band behavior in frequency band of interest for commercial wireless communication systems