• DocumentCode
    2711869
  • Title

    Managing performance-reliability tradeoffs in multicore processors

  • Author

    Song, William J. ; Mukhopadhyay, Saibal ; Yalamanchili, Sudhakar

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2015
  • fDate
    19-23 April 2015
  • Abstract
    There is a fundamental tradeoff between processor performance and lifetime reliability. High throughput operations increase power and heat dissipations that have adverse impacts on lifetime reliability. On the contrary, lifetime reliability favors low utilization to reduce stresses and avoid failures. A key challenge of understanding this tradeoff is in connecting application characteristics to device-level degradation behaviors. Using a full-system microarchitecture and physics simulation, the performance-reliability tradeoff in a multicore processor is analyzed by introducing a metric, throughput-lifetime product (TLP). A finding reveals that reducing the variance of degradation distribution on the multicore die leads to effectively enhancing processor lifetime with minimal impact on performance. This concept is referred to as dynamic reliability variance management (DRVM). We discuss three possible microarchitectural techniques that perform DRVM and improve the TLP; i) phase-aware thread migration, ii) dynamic voltage scaling, and iii) turbo-mode execution combined with DRVM. The simulation results with selected PARSEC and SPLASH-2 benchmarks show that DRVM techniques improve processor lifetime up to 15% or enhance the throughput-lifetime tradeoff by 12% without adding extra design margins or spare components on the multicore die.
  • Keywords
    failure analysis; integrated circuit reliability; microprocessor chips; multiprocessing systems; DRVM; PARSEC benchmarks; SPLASH-2 benchmarks; TLP; degradation distribution variance; device-level degradation behaviors; dynamic reliability variance management; dynamic voltage scaling; failure avoidance; full-system microarchitecture techniques; heat dissipations; lifetime reliability; multicore die; multicore processors; performance-reliability tradeoff management; phase-aware thread migration; physics simulation; processor performance; stress reduction; throughput-lifetime product; turbo-mode execution; Benchmark testing; Degradation; Microarchitecture; Multicore processing; Performance evaluation; Program processors; Reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium (IRPS), 2015 IEEE International
  • Conference_Location
    Monterey, CA
  • Type

    conf

  • DOI
    10.1109/IRPS.2015.7112707
  • Filename
    7112707