DocumentCode :
2712018
Title :
Test structure for thermal monitoring
Author :
Székely, V. ; Kohári, Zs ; Márta, Cs ; Rencz, M. ; Courtois, B.
Author_Institution :
Dept. of Electron Devices, Tech. Univ. Budapest, Hungary
fYear :
1996
fDate :
25-28 Mar 1996
Firstpage :
111
Lastpage :
115
Abstract :
The paper is dealing with thermal test structures for CMOS ICs. A new temperature sensor/test structure is proposed: the Thermal Feedback Oscillator (TFO). Detailed design considerations are presented together with experimental results. Moreover the paper discusses general questions of the “design for thermal testability” (DfTT) principle including both the problems of placement of the test structures and possible solutions for the read-out of the test data
Keywords :
CMOS integrated circuits; design for testability; feedback oscillators; integrated circuit testing; temperature sensors; CMOS IC; design for thermal testability; temperature sensor; test structure; thermal feedback oscillator; thermal monitoring; Area measurement; Circuit testing; Design for testability; Frequency; Life testing; Monitoring; System testing; Temperature sensors; Thermal sensors; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microelectronic Test Structures, 1996. ICMTS 1996. Proceedings. 1996 IEEE International Conference on
Conference_Location :
Trento
Print_ISBN :
0-7803-2783-7
Type :
conf
DOI :
10.1109/ICMTS.1996.535630
Filename :
535630
Link To Document :
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