Title :
Modeling fatigue behavior of electronically conductive adhesive joints under elevated temperature and humidity conditions
Author :
Gomatam, Rajesh R. ; Sancaktar, Erol
Keywords :
Conductive adhesives; Design engineering; Electronics packaging; Fatigue; Humidity; Life estimation; Life testing; Residual stresses; Temperature; Thermal stresses;
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on
Print_ISBN :
0-7803-8744-9
DOI :
10.1109/POLYTR.2004.1402734
