Title :
Application of critical stress intensity factors to evaluate adhesive failure at underfill/passivation interface singularities
Author :
McAdams, Brian J. ; Pearson, Raymond A.
Keywords :
Adhesives; Assembly; Delamination; Geometry; Microelectronics; Passivation; Semiconductor device packaging; Structural beams; Tensile stress; Testing;
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on
Print_ISBN :
0-7803-8744-9
DOI :
10.1109/POLYTR.2004.1402735
