DocumentCode
2712209
Title
Conductiveadhesives containing Ag-Sn alloys as conductive filler
Author
Suzuki, Kenichi ; Shirai, Yukio ; Mizumura, Noritsuka ; Komagata, Michinon
fYear
2004
fDate
12-15 Sept. 2004
Firstpage
57
Lastpage
62
Keywords
Adhesives; Contact resistance; Copper; Electrical resistance measurement; Integrated circuit interconnections; Resistors; Semiconductor device measurement; Silver; Testing; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on
Print_ISBN
0-7803-8744-9
Type
conf
DOI
10.1109/POLYTR.2004.1402739
Filename
1402739
Link To Document