Title :
Simulation of warpage considering both thermal and cure induced shrinkage during molding in IC packaging
Author :
Hong, Li-Ching ; Hwang, Sheng-Jye ; Lee, Huei-Huang ; Durn-Yuan Huang
Keywords :
Computational modeling; Costs; Electromagnetic compatibility; Electronic packaging thermal management; Equations; Integrated circuit packaging; Plastic packaging; Predictive models; Temperature; Thermal engineering;
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on
Print_ISBN :
0-7803-8744-9
DOI :
10.1109/POLYTR.2004.1402743
