DocumentCode
2712303
Title
A Hybrid Integrated Power Electronic Module Based On Pressure Contact Technology
Author
Xiaoyu He ; Xiangjun Zeng ; Xu Yang ; Zhaoan Wang
Author_Institution
Power Electron. & Renewable Energy Res. Center, Xi´an Jiaotong Univ.
fYear
2006
fDate
18-22 June 2006
Firstpage
1
Lastpage
5
Abstract
This paper presents a simple, wireless-bond power electronics packaging technology utilizing spring pressure contact interconnect technique. The pressure contact spring is made of beryllium-copper alloy with small outline and excellent stress performance. Based on the technique, a 4 kW half-bridge power inverter module is fabricated. Electrical, thermal and mechanical test results of the packaged device are reported
Keywords
beryllium alloys; copper alloys; electronics packaging; interconnections; invertors; 4 kW; beryllium-copper alloy; half-bridge power inverter module; hybrid integrated power electronic module; pressure contact technology; spring pressure contact interconnect technique; wireless-bond power electronics packaging technology; Bonding; Contact resistance; Copper; Electronic packaging thermal management; Insulated gate bipolar transistors; Springs; Thermal conductivity; Thermal resistance; Thermal stresses; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics Specialists Conference, 2006. PESC '06. 37th IEEE
Conference_Location
Jeju
ISSN
0275-9306
Print_ISBN
0-7803-9716-9
Type
conf
DOI
10.1109/PESC.2006.1711929
Filename
1711929
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