Title :
A Hybrid Integrated Power Electronic Module Based On Pressure Contact Technology
Author :
Xiaoyu He ; Xiangjun Zeng ; Xu Yang ; Zhaoan Wang
Author_Institution :
Power Electron. & Renewable Energy Res. Center, Xi´an Jiaotong Univ.
Abstract :
This paper presents a simple, wireless-bond power electronics packaging technology utilizing spring pressure contact interconnect technique. The pressure contact spring is made of beryllium-copper alloy with small outline and excellent stress performance. Based on the technique, a 4 kW half-bridge power inverter module is fabricated. Electrical, thermal and mechanical test results of the packaged device are reported
Keywords :
beryllium alloys; copper alloys; electronics packaging; interconnections; invertors; 4 kW; beryllium-copper alloy; half-bridge power inverter module; hybrid integrated power electronic module; pressure contact technology; spring pressure contact interconnect technique; wireless-bond power electronics packaging technology; Bonding; Contact resistance; Copper; Electronic packaging thermal management; Insulated gate bipolar transistors; Springs; Thermal conductivity; Thermal resistance; Thermal stresses; Wire;
Conference_Titel :
Power Electronics Specialists Conference, 2006. PESC '06. 37th IEEE
Conference_Location :
Jeju
Print_ISBN :
0-7803-9716-9
DOI :
10.1109/PESC.2006.1711929
