Title :
High frequency flip chip interconnection on liquid crystal polymer substrate using anisotropic conductive adhesive
Author :
Gang Zou ; Gronqvist, H. ; Zonghe Lai ; SodervalI, U. ; Liu, Jiangchuan
Abstract :
An ACA flip-chip assembly of an MMIC on liquid crystal polymer (LCP) substrate is presented in this paper. The high frequency performance has been simulated using a lumped element model. The finite element method (FEM) computation of the thermal mechanical characterization of the ACA flip chip assembly in a cooling process was performed. The simulation results show that LCP has good high frequency performance. The LCP substrate has better thermal mechanical performance than a Teflon substrate.
Keywords :
Anisotropic magnetoresistance; Assembly; Bonding; Conductive adhesives; Electronic packaging thermal management; Flip chip; Frequency; Liquid crystal polymers; MMICs; Switches;
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on
Conference_Location :
Portland, OR, USA
Print_ISBN :
0-7803-8744-9
DOI :
10.1109/POLYTR.2004.1402753
