DocumentCode
2712917
Title
Novel adhesive tapes for semiconductor manufacturing process
Author
Sugino, Takashi ; Saik, Naoya ; Shinoda, Tomonori ; Yamazaki, Osamu
fYear
2004
fDate
12-15 Sept. 2004
Firstpage
262
Lastpage
268
Keywords
Computer hacking; Curing; Epoxy resins; Fabrication; Integrated circuit packaging; Manufacturing processes; Microassembly; Polymers; Semiconductor device manufacture; Semiconductor materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on
Print_ISBN
0-7803-8744-9
Type
conf
DOI
10.1109/POLYTR.2004.1402772
Filename
1402772
Link To Document