DocumentCode :
2712917
Title :
Novel adhesive tapes for semiconductor manufacturing process
Author :
Sugino, Takashi ; Saik, Naoya ; Shinoda, Tomonori ; Yamazaki, Osamu
fYear :
2004
fDate :
12-15 Sept. 2004
Firstpage :
262
Lastpage :
268
Keywords :
Computer hacking; Curing; Epoxy resins; Fabrication; Integrated circuit packaging; Manufacturing processes; Microassembly; Polymers; Semiconductor device manufacture; Semiconductor materials;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. 4th IEEE International Conference on
Print_ISBN :
0-7803-8744-9
Type :
conf
DOI :
10.1109/POLYTR.2004.1402772
Filename :
1402772
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2712917
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