Title :
Interconnect modeling for high speed digital and RF circuits and systems
Author_Institution :
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
Abstract :
Modeling techniques to characterize interconnects and transmission structures in digital ICs and RF modules and IC packages are presented. Electromagnetic simulation and measurements are used to extract CAD compatible equivalent circuits for typical high speed digital and RF package components. Examples of coupled interconnects in multilayer boards and packages are included to demonstrate the techniques
Keywords :
digital integrated circuits; digital simulation; equivalent circuits; integrated circuit interconnections; integrated circuit packaging; CAD compatible equivalent circuits; IC packages; RF modules; coupled interconnects; digital ICs; electromagnetic simulation; interconnect modeling; multilayer boards; package components; transmission structures; Circuit simulation; Digital integrated circuits; Electromagnetic compatibility; Electromagnetic measurements; Integrated circuit interconnections; Integrated circuit modeling; Integrated circuit packaging; Radio frequency; Radiofrequency integrated circuits; Velocity measurement;
Conference_Titel :
Microwave Conference Proceedings, 1997. APMC '97, 1997 Asia-Pacific
Print_ISBN :
962-442-117-X
DOI :
10.1109/APMC.1997.656392
