DocumentCode
2714068
Title
Interconnect modeling for high speed digital and RF circuits and systems
Author
Tripathi, V.K.
Author_Institution
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
Volume
3
fYear
1997
fDate
2-5 Dec 1997
Firstpage
1037
Abstract
Modeling techniques to characterize interconnects and transmission structures in digital ICs and RF modules and IC packages are presented. Electromagnetic simulation and measurements are used to extract CAD compatible equivalent circuits for typical high speed digital and RF package components. Examples of coupled interconnects in multilayer boards and packages are included to demonstrate the techniques
Keywords
digital integrated circuits; digital simulation; equivalent circuits; integrated circuit interconnections; integrated circuit packaging; CAD compatible equivalent circuits; IC packages; RF modules; coupled interconnects; digital ICs; electromagnetic simulation; interconnect modeling; multilayer boards; package components; transmission structures; Circuit simulation; Digital integrated circuits; Electromagnetic compatibility; Electromagnetic measurements; Integrated circuit interconnections; Integrated circuit modeling; Integrated circuit packaging; Radio frequency; Radiofrequency integrated circuits; Velocity measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference Proceedings, 1997. APMC '97, 1997 Asia-Pacific
Print_ISBN
962-442-117-X
Type
conf
DOI
10.1109/APMC.1997.656392
Filename
656392
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