DocumentCode :
27141
Title :
Effect of surface fluorination on space charge behavior in multilayered polyimide films
Author :
Du, B. ; Li, Jie ; Du, Honglei ; Yin, Yingjie
Author_Institution :
School of Electrical Engineering and Automation Tianjin University, Tianjin 300072, China
Volume :
21
Issue :
4
fYear :
2014
fDate :
Aug-14
Firstpage :
1817
Lastpage :
1823
Abstract :
In recent years, the multilayered polyimide films have been widely used in flexible Print- Circuit Board in order to reduce the thickness of the combination of the flexible Print- Circuit Board. The existence of space charge as a main reason for dielectric breakdown, has a great effect on breakdown characteristic. So it is important to study the space charge characteristics of the multilayered polyimide films. Fluorination can change the chemical component in surface layer of polymers and therefore can influence the charge injection from electrodes and affect the electrical properties of the surface layer. This paper presents a study aimed at clarifying the effect of fluorination on space charge behavior in multilayered polyimide films. Samples were fluorinated in a laboratory vessel at 328 K (55 °C) using a F2/N2 mixture with 20% F2 by volume and 0.05 MPa (500 mbar) for respectively 15, 30, 45 and 60 minutes. The surface chemical compositions of the films were characterized by attenuated total reflection infrared analysis. The space charge distributions in multilayered polyimide films were measured by using the pulsed electroacoustic (PEA) method. Obtained results showed that the space charge distribution of multilayered film stacking with five fluorinated samples was quite different from that of multilayered film stacking with five untreated samples. It is also suggested that the fluorination can significantly suppress the injection of space charge.
Keywords :
Anodes; Chemicals; Conductivity; Films; Polyimides; Space charge; Stacking; Multilayered polyimide film; charge accumulation; dynamic behavior; space charge; surface fluorination;
fLanguage :
English
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
Publisher :
ieee
ISSN :
1070-9878
Type :
jour
DOI :
10.1109/TDEI.2014.004306
Filename :
6878011
Link To Document :
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