DocumentCode
271454
Title
Gate Voltage Contribution to Neutron-Induced SEB of Trench Gate Fieldstop IGBT
Author
Foro, L.L. ; Touboul, A.D. ; Michez, A. ; Wrobel, F. ; Rech, P. ; Dilillo, L. ; Frost, Christopher ; SaigneÌ, FreÌdeÌric
Author_Institution
IES, Univ. Montpellier II, Montpellier, France
Volume
61
Issue
4
fYear
2014
fDate
Aug. 2014
Firstpage
1739
Lastpage
1746
Abstract
Single Event Burnout and Gate Rupture are catastrophic failures due to cosmic rays that can occur simultaneously. It is shown that negatively biasing the gate leads to a substantial increase of SEB cross section in particular when the collector voltage is closer to the safe operating area of the device.
Keywords
cosmic rays; insulated gate bipolar transistors; neutron effects; radiation hardening (electronics); semiconductor device breakdown; cosmic rays; gate oxide breakdown; insulated gate bipolar transistors; neutron-induced SEB; single event burnout; single event gate rupture; trench gate fieldstop IGBT; Electric breakdown; Failure analysis; Insulated gate bipolar transistors; Logic gates; MOSFET; Neutrons; Substrates; Atmospheric neutrons; Single Event Burnout (SEB); Single Event Gate Rupture (SEGR); cross section; gate oxide breakdown; insulated gate bipolar transistor (IGBT); trench gate fieldstop;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/TNS.2014.2332813
Filename
6869059
Link To Document