• DocumentCode
    2715382
  • Title

    MMIC and Module Design and Performance for Millimetric Transceiver Front-ends for Transport Applications

  • Author

    Powell, J.R. ; Munday, P.D. ; Tang, W. H A ; Hunt, R.C. ; Gunton, D.J.

  • Author_Institution
    QinetiQ Ltd, Malvern
  • fYear
    2006
  • fDate
    11-16 June 2006
  • Firstpage
    1497
  • Lastpage
    1500
  • Abstract
    Millimeter wave transceiver front-end modules have been made for use in high data rate telematics transceiver applications in the frequency band 63 to 64 GHz. The modules incorporate a highly integrated core-transceiver MMIC, fabricated using a commercially available production GaAs pHEMT technology, for up- and down- conversion, signal amplification and image rejection functions. Packaging technologies are identified to realise potential low cost production of the front-ends. Under the millimetric tansceivers for transport applications (MILTRANS) project, a consortium of UK organisations, this hardware has been used in a system demonstrator based on modulation schemes compliant with the IEEE 802.11a standard and using a custom antenna designed for vehicle-to-roadside and vehicle-to-vehicle communications. Front-end performance characteristics are reported together with initial system performance for a network of nodes operated in static and mobile configurations
  • Keywords
    HEMT integrated circuits; III-V semiconductors; MMIC; gallium arsenide; integrated circuit design; transceivers; 63 to 64 GHz; GaAs; IEEE 802.11a standard; MILTRANS; MMIC; antenna design; down-conversion; image rejection functions; millimeter wave transceiver front-end modules; millimetric tansceivers for transport applications project; millimetric transceiver front-ends; module design; pHEMT technology; packaging technologies; signal amplification; system demonstrator; telematics transceiver; up-conversion; vehicle-to-roadside communications; vehicle-to-vehicle communications; Frequency; Gallium arsenide; Image converters; MMICs; Millimeter wave technology; PHEMTs; Packaging; Production; Telematics; Transceivers; Integrated circuit packaging; MIMICs; Millimeter wave communications; Mobile communication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 2006. IEEE MTT-S International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-9541-7
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2006.249576
  • Filename
    4015217