DocumentCode
2715425
Title
An innovative high frequency microdischarge detection technique
Author
Stopher, J. ; Dollinger, R.
Author_Institution
State Univ. of New York, Buffalo, NY, USA
fYear
1994
fDate
5-8 Jun 1994
Firstpage
237
Lastpage
240
Abstract
Today´s modern electrical devices are increasingly subject to, and must withstand, high frequency stressing. Such stressing contributes to accelerated aging of electrical insulation and has resulted in premature failure of components. In order to understand the aging mechanisms (i.e. erosion) and make valid conclusions regarding the service lifetime of components used under high frequency conditions, the electrical insulation must be examined under the same high frequency conditions as that it will be used. Conventional electrical techniques used to detect partial discharges are limited to below 2 kHz applied ac test voltages. In order to stress electrical insulation and examine the microdischarge activity for frequencies up to 100 MHz, a new technique was developed. This technique uses series resonance to achieve high frequency sinusoidal steady state ac test voltage and a bridge type test cell to detect the resulting microdischarge activity. Calibration and simulations support the critically damped single output pulse per discharge events temporal resolution of <0.5 μs. Typical output traces are presented and preliminary test data is presented
Keywords
ageing; failure analysis; high-frequency discharges; insulation testing; life testing; partial discharges; 2 to 100 kHz; ac test voltages; accelerated aging; aging mechanisms; bridge type test cell; critically damped single output pulse; electrical insulation; high frequency microdischarge detection; high frequency stressing; partial discharges; premature failure; series resonance; temporal resolution; Accelerated aging; Bridge circuits; Dielectrics and electrical insulation; Frequency; Partial discharges; Resonance; Steady-state; Stress; Testing; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation, 1994., Conference Record of the 1994 IEEE International Symposium on
Conference_Location
Pittsburgh, PA
ISSN
1089-084X
Print_ISBN
0-7803-1942-7
Type
conf
DOI
10.1109/ELINSL.1994.401522
Filename
401522
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