Title :
Direct bonding of piezoelectric materials onto Si
Author :
Eda, Kazuo ; Tomita, Yoshihiro ; Sugimoto, Masato ; Ogura, Tetsuyoshi ; Nanba, Aluhiko ; Taguchi, Yutaka ; Kawasaki, Osamu
Author_Institution :
Dev. Eng. Dev. Centre, Matsushita Electr. Ind. Co. Ltd., Kadoma, Japan
Abstract :
New composite semiconductor-piezoelectric materials fabricated by direct bonding technology are reported. The fabrication process, analysis of the bonded interface microstructures, and their applications are also reported
Keywords :
composite material interfaces; composite materials; elemental semiconductors; piezoelectric materials; silicon; wafer bonding; Si; composite semiconductor-piezoelectric material; direct bonding; fabrication; interface microstructure; Bonding forces; Crystalline materials; Crystallization; Fabrication; Microstructure; Piezoelectric devices; Piezoelectric materials; Semiconductor materials; Space technology; Substrates;
Conference_Titel :
Applications of Ferroelectrics, 1996. ISAF '96., Proceedings of the Tenth IEEE International Symposium on
Conference_Location :
East Brunswick, NJ
Print_ISBN :
0-7803-3355-1
DOI :
10.1109/ISAF.1996.598125
