Novel Broadband Planar Balun Using Multiple Coupled Lines

Author

Chen, Yu-Liang ; Lin, Hung-Hsuan

Author_Institution

Inf. & Commun. Res. Labs., Ind. Technol. Res. Inst., Hsinchu

fYear

2006

fDate

11-16 June 2006

Firstpage

1571

Lastpage

1574

Abstract

This study presents a novel broadband planar balun using multiple coupled lines, which are realized easily in thick-multi-layer structures, to improve broadband characteristics compared with the conventional planar Marchand balun. Additionally, an extra shunt capacitor is added to compensate the output amplitude and phase imbalances due to inductive grounding-vias. This balun is fabricated by LTCC (low temperature co-fired ceramic) technology and miniaturized successfully to 3.2 mm times 2.5 mm times 1 mm for UWB applications (3.1-8.0 GHz). Finally, the measured results agree well with the electromagnetic (EM) simulated responses

Keywords

baluns; ceramic packaging; microwave circuits; 1 mm; 2.5 mm; 3.1 to 8.0 GHz; 3.2 mm; Marchand balun; broadband planar balun; coupled lines; low temperature co-fired ceramic technology; shunt capacitor; Bandwidth; Capacitors; Circuit topology; Communication industry; Coupling circuits; Dielectric substrates; Equivalent circuits; Filters; Impedance matching; MMICs; Balun; LTCC; UWB; coupled line; marchand balun; multi-layer;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium Digest, 2006. IEEE MTT-S International

Conference_Location

San Francisco, CA

ISSN

0149-645X

Print_ISBN

0-7803-9541-7

Electronic_ISBN

0149-645X

Type

conf

DOI

10.1109/MWSYM.2006.249615

Filename

4015237