Title :
Novel Broadband Planar Balun Using Multiple Coupled Lines
Author :
Chen, Yu-Liang ; Lin, Hung-Hsuan
Author_Institution :
Inf. & Commun. Res. Labs., Ind. Technol. Res. Inst., Hsinchu
Abstract :
This study presents a novel broadband planar balun using multiple coupled lines, which are realized easily in thick-multi-layer structures, to improve broadband characteristics compared with the conventional planar Marchand balun. Additionally, an extra shunt capacitor is added to compensate the output amplitude and phase imbalances due to inductive grounding-vias. This balun is fabricated by LTCC (low temperature co-fired ceramic) technology and miniaturized successfully to 3.2 mm times 2.5 mm times 1 mm for UWB applications (3.1-8.0 GHz). Finally, the measured results agree well with the electromagnetic (EM) simulated responses
Keywords :
baluns; ceramic packaging; microwave circuits; 1 mm; 2.5 mm; 3.1 to 8.0 GHz; 3.2 mm; Marchand balun; broadband planar balun; coupled lines; low temperature co-fired ceramic technology; shunt capacitor; Bandwidth; Capacitors; Circuit topology; Communication industry; Coupling circuits; Dielectric substrates; Equivalent circuits; Filters; Impedance matching; MMICs; Balun; LTCC; UWB; coupled line; marchand balun; multi-layer;
Conference_Titel :
Microwave Symposium Digest, 2006. IEEE MTT-S International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-9541-7
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2006.249615
