Title :
Silicon micromachining technology for THz applications
Author :
Jung, C. ; Lee, C. ; Thomas, B. ; Chattopadhyay, G. ; Peralta, A. ; Lin, R. ; Gill, J. ; Mehdi, I.
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
Abstract :
Silicon micromachining technology is naturally suited for making THz components, where precision and accuracy are essential. We report here the development of a robust micromachining technology that has enabled us to make waveguide features in the 325 to 500 GHz range with nominal losses. Extension of this technology towards a wafer-level integrated submillimeter-wave receiver front-end is also discussed. This novel wafer-stacking architecture will enable ultra-compact two dimensional multi-pixel receiver front-ends in the THz range.
Keywords :
micromachining; radiometers; surface roughness; surface topography measurement; terahertz wave devices; THz applications; silicon micromachining technology; ultra compact 2D multi-pixel receiver front-ends; wafer-level integrated submillimeter-wave receiver front-end; Metals; Micromachining; Receivers; Silicon; Surface roughness; Surface waves; Waveguide components;
Conference_Titel :
Infrared Millimeter and Terahertz Waves (IRMMW-THz), 2010 35th International Conference on
Conference_Location :
Rome
Print_ISBN :
978-1-4244-6655-9
DOI :
10.1109/ICIMW.2010.5612771
