DocumentCode :
2715829
Title :
The Making of the Perfect MOSFET
Author :
Elbanhawy, A.
Author_Institution :
Fairchild Semicond., San Jose, CA
fYear :
2006
fDate :
18-22 June 2006
Firstpage :
1
Lastpage :
5
Abstract :
Demanding applications like the core dc-dc converter in personal computers is placing great demands on the power semiconductor industry to develop new devices that challenges silicon and packaging technologies to the limit
Keywords :
DC-DC power convertors; power MOSFET; semiconductor device packaging; MOSFET; dc-dc converter; packaging technologies; personal computers; power semiconductor industry; Bonding; Buck converters; DC-DC power converters; Inductance; MOSFET circuits; Power MOSFET; Semiconductor device packaging; Silicon; Switching frequency; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics Specialists Conference, 2006. PESC '06. 37th IEEE
Conference_Location :
Jeju
ISSN :
0275-9306
Print_ISBN :
0-7803-9716-9
Type :
conf
DOI :
10.1109/PESC.2006.1712137
Filename :
1712137
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2715829
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