• DocumentCode
    271615
  • Title

    Statistical modeling of electrochemical metallization memory cells

  • Author

    Menzel, Stephan ; Valov, I. ; Waser, Rainer ; Wolf, B. ; Tappertzhofen, S. ; Böttger, Ulrich

  • Author_Institution
    Peter Grunberg Inst., Forschungszentrum Julich & JARA-FIT Julich, Jülich, Germany
  • fYear
    2014
  • fDate
    18-21 May 2014
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Redox-based resistive switching devices have attracted great interest for future nonvolatile memory application. The electrochemical metallization memory (ECM) cell is one variant of these devices. One issue is the variability of the resistive switching in ECM cells. Thus, statistical models that capture the variability of ECM cells are required to enable circuit design. This works presents a statistical model for the resistive switching in ECM cells that is based on the electrochemical driven growth and dissolution of a metallic filament. The simulation results are validated using experimental data.
  • Keywords
    integrated circuit metallisation; integrated circuit modelling; random-access storage; statistical analysis; ECM cell; ReRAM; circuit design; electrochemical driven growth; electrochemical metallization memory cells; metallic filament dissolution; nonvolatile memory application; redox based resistive memories; redox-based resistive switching devices; statistical modeling; Electrodes; Electronic countermeasures; Integrated circuit modeling; Kinetic theory; Metallization; Resistance; Switches; ECM; electrochemical metallization cells; quantized conduction; resistive switching memory (ReRAM);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Memory Workshop (IMW), 2014 IEEE 6th International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4799-3594-9
  • Type

    conf

  • DOI
    10.1109/IMW.2014.6849360
  • Filename
    6849360