Title :
Characteristics of Microstrip Lines through a Metalized EBG Substrate
Author :
Yang, H. Y David ; Zhou, Chengzhi
Author_Institution :
Dept. of Electr. & Comput. Eng., Illinois Univ., Chicago, IL
Abstract :
This paper presents the analysis of a microstrip line surrounded by metalized substrates. The metalized substrates are dielectric substrates with vias through and either with or without patch covers. The guided-wave characteristics are investigated by full-wave electromagnetic simulations with experimental verification. It is found that the metalized substrate would increase the phase constant (slow-wave factor) and decrease the characteristic impedance of a microstrip line. When a microstrip line is in contact with the surrounding vias, the structure is in analogy to a metallic waveguide with a cut-off frequency. The mode properties are also characterized
Keywords :
dielectric waveguides; electromagnetic wave propagation; microstrip lines; photonic band gap; substrates; EBG substrate; characteristic impedance; dielectric substrates; electromagnetic band-gap; full-wave electromagnetic simulations; guided-wave characteristics; metalized substrate; metallic waveguide; microstrip lines; propagation constant; surrounding vias; Application specific integrated circuits; Dielectric substrates; Distributed parameter circuits; Impedance; Metamaterials; Microstrip; Periodic structures; Propagation constant; Surface waves; Transmission line theory; Microstrip lines; characteristic impedance; electromagnetic band-gap; guided-wave; propagation constant;
Conference_Titel :
Microwave Symposium Digest, 2006. IEEE MTT-S International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-9541-7
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2006.249675
