• DocumentCode
    2716376
  • Title

    Highly Integrated 60 GHz-band x12 Multiplier MMIC

  • Author

    Ito, Masaharu ; Kishimoto, Shuya ; Morimoto, Takao ; Hamada, Yasuhiro ; Maruhashi, Kenichi

  • Author_Institution
    Syst. Devices Res. Labs., NEC Corp., Shiga
  • fYear
    2006
  • fDate
    11-16 June 2006
  • Firstpage
    1697
  • Lastpage
    1700
  • Abstract
    This paper presents a 60 GHz-band times12 multiplier MMIC. The multiplier consists of a quadrupler and a following tripler. In order to integrate them in a single chip with a size of 2.5 mm times 1.15 mm, lumped elements are adopted for matching and suppression circuits. A capacitor is introduced between fundamental and 2nd harmonic suppression stubs of a quadrupler so as to improve the suppression level. The fabricated multiplier exhibits an output power of higher than 0 dBm from 58 to 63 GHz with an input power of -5 dBm. The adjacent 11 th and 13th harmonic suppressions are larger than 20 dBc at a center frequency of 60.6 GHz. The multiplier is also mounted in an LTCC package using a flip-chip bonding technique. The flipped multiplier shows a decrease of 4 dB in the output power in the temperature range from -20 to 80 degC. As far as the authors know, this is the first times12 FET-multiplier MMIC in a millimeter-wave band
  • Keywords
    MMIC; flip-chip devices; integrated circuit bonding; integrated circuit design; integrated circuit manufacture; multiplying circuits; -20 to 80 C; 1.15 mm; 2.5 mm; 58 to 63 GHz; FET-multiplier MMIC; LTCC package; MODFET; capacitor; coplanar waveguides; flip-chip bonding; flip-chip devices; flipped multiplier; frequency conversion; harmonic suppression stubs; lumped elements; matching circuits; millimeter wave devices; millimeter-wave band; multiplier MMIC; quadrupler; suppression circuits; tripler; Bonding; Capacitors; Circuits; Frequency; Harmonics suppression; MMICs; Millimeter wave technology; Packaging; Power generation; Temperature distribution; Coplanar waveguides; MMICs; MODFETs; flip-chip devices; frequency conversion; millimeter wave devices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Symposium Digest, 2006. IEEE MTT-S International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0149-645X
  • Print_ISBN
    0-7803-9541-7
  • Electronic_ISBN
    0149-645X
  • Type

    conf

  • DOI
    10.1109/MWSYM.2006.249687
  • Filename
    4015273