DocumentCode :
2716376
Title :
Highly Integrated 60 GHz-band x12 Multiplier MMIC
Author :
Ito, Masaharu ; Kishimoto, Shuya ; Morimoto, Takao ; Hamada, Yasuhiro ; Maruhashi, Kenichi
Author_Institution :
Syst. Devices Res. Labs., NEC Corp., Shiga
fYear :
2006
fDate :
11-16 June 2006
Firstpage :
1697
Lastpage :
1700
Abstract :
This paper presents a 60 GHz-band times12 multiplier MMIC. The multiplier consists of a quadrupler and a following tripler. In order to integrate them in a single chip with a size of 2.5 mm times 1.15 mm, lumped elements are adopted for matching and suppression circuits. A capacitor is introduced between fundamental and 2nd harmonic suppression stubs of a quadrupler so as to improve the suppression level. The fabricated multiplier exhibits an output power of higher than 0 dBm from 58 to 63 GHz with an input power of -5 dBm. The adjacent 11 th and 13th harmonic suppressions are larger than 20 dBc at a center frequency of 60.6 GHz. The multiplier is also mounted in an LTCC package using a flip-chip bonding technique. The flipped multiplier shows a decrease of 4 dB in the output power in the temperature range from -20 to 80 degC. As far as the authors know, this is the first times12 FET-multiplier MMIC in a millimeter-wave band
Keywords :
MMIC; flip-chip devices; integrated circuit bonding; integrated circuit design; integrated circuit manufacture; multiplying circuits; -20 to 80 C; 1.15 mm; 2.5 mm; 58 to 63 GHz; FET-multiplier MMIC; LTCC package; MODFET; capacitor; coplanar waveguides; flip-chip bonding; flip-chip devices; flipped multiplier; frequency conversion; harmonic suppression stubs; lumped elements; matching circuits; millimeter wave devices; millimeter-wave band; multiplier MMIC; quadrupler; suppression circuits; tripler; Bonding; Capacitors; Circuits; Frequency; Harmonics suppression; MMICs; Millimeter wave technology; Packaging; Power generation; Temperature distribution; Coplanar waveguides; MMICs; MODFETs; flip-chip devices; frequency conversion; millimeter wave devices;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest, 2006. IEEE MTT-S International
Conference_Location :
San Francisco, CA
ISSN :
0149-645X
Print_ISBN :
0-7803-9541-7
Electronic_ISBN :
0149-645X
Type :
conf
DOI :
10.1109/MWSYM.2006.249687
Filename :
4015273
Link To Document :
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