Title :
Improved Smart Power Modules for up to 7kW Motor Drive Applications
Author :
Jun-Bae Lee ; Dae-Woong Chung ; Bum-Seok Suh ; Dong-Seok Hyun
Author_Institution :
Motion Control System Team, Functional Power Group, Fairchild Semiconductor, 82-3, Dodang-Dong, Wonmi-Gu, Bucheon-Si, Gyeonggi-Do, KOREA, E-mail: jb.lee@fairchildsemi.co.kr
Abstract :
This paper introduces the improved Motion-SPM™ (Smart Power Modules) in DIP package, which is fully optimized intelligent integrated IGBT inverter modules for up to 7kW motor drive applications. Although its external size is same as a previous iteration of Motion-SPM in DIP, the operating current rating has been increased to 75A compared to an earlier iteration of Motion-SPM of 30A. It comes to be small by employing size-related design and highly integrated building blocks having the built-in HVICs. It also provides technical advantages such as the good thermal performances through DBC(Direct Bonded Copper), the high latch immunity and dv/dt controlled HVIC driving. This paper provides an overall description of the improved Motion-SPM in DIP as well as actual application issues such as electrical characteristics, circuit configurations, thermal performance and power ratings.
Keywords :
Bonding; Circuits; Copper; Electric variables; Electronics packaging; Insulated gate bipolar transistors; Inverters; Latches; Motor drives; Multichip modules;
Conference_Titel :
Power Electronics Specialists Conference, 2006. PESC '06. 37th IEEE
Print_ISBN :
0-7803-9716-9
DOI :
10.1109/PESC.2006.1712209